oTSV (Through-Silicon Via): A vertical electrical connection (via) that passes completely through a silicon wafer or die. Used in 3DIC or 2.5D Chips, allowing different dies to be stacked vertically and interconnected directly using TSV and bumps.
- Physical Definition (LEF): A TSV would be defined in a manner similar to a standard via but with unique properties:
- Layer Type defined as “TSV” so tool understands it is not normal cut layer.
- It would have specific landing and covering layers (top and bottom metals it connects to).
- Dimensions (diameter, pitch).
- TSV-to-TSV or other metal spacing rules