o Via Pillar: A structure used in advanced process nodes (like FinFET nodes) to create a lower-resistance vertical connection between metal layers compared to traditional single vias or via arrays. It typically consists of:
Stacked, short metal segments (“fingers”) on intermediate metal layers, aligned vertically.
These segments are connected by vias above and below, essentially forming a “pillar” of alternating via and short metal bar segments running vertically through multiple layers.